Shanghai Belling Wins the 2025 Influential Automotive Chip Award, Reaffirming Its Hardcore Strength
Time:2025-07-28 View:57


The 21st Shanghai International Automobile Industry Exhibition was held at the National Exhibition and Convention Center in Shanghai from April 23 to May 2, 2025. As an important indicator of the global automotive industry's technology and market, this auto show attracted many industry giants to showcase their cutting - edge achievements.

 

During the auto show, on the afternoon of April 25, 2025, the China Automotive Chip Industry Innovation Strategic Alliance and China Electronics News held the "2025 China Automotive Chip Industry Innovation Achievements" awarding ceremony in the "China Chip" exhibition area of the 2025 Shanghai International Auto Show. Shanghai Belling won the 2025 Influential Automotive Chip Award with its engine ignition IGBT BLG3040 product, once again validating its technological strength. This award is established for domestic automotive chip products that have been mass - produced and applied. The products should feature a certain degree of technological advancement and innovation, excellent market performance, and a wide customer base.

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Meanwhile, Shanghai Belling participated in the "Innovative Energy, Shaping the Future - Automotive Chip Technology Press Conference" held at the Huada Semiconductor 8BC006 booth during the 2025 Shanghai Auto Show. Zhang Fei, the automotive electronics market manager of Shanghai Belling, introduced the industrial layout and technological development trends of automotive chips to the visiting guests.

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Recommended Automotive Electronic Products of Belling

 

01. Engine Ignition IGBT Series Products: BLG3040 / BLQG3040A / BLQG5036 / BLQG3040E, etc.

Product Features: Low on - state loss, enhanced SCIS capability. The internally integrated diode can provide voltage clamping without the need for external components.

Applications: Engine ECUs, ignition coils, etc.

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02. Linear Constant - Current LED Headlight Driver Series Products: MEDS92630 / MEDS7610

Product Features: Three - channel/one - channel, with analog and PWM dimming control functions, comprehensive fault detection, and built - in protection functions.

Applications: Taillights, daytime running lights, parking lights, fog lights, position lights, interior lighting, etc.

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03. Automotive - Grade 650V, 1200V IGBT Products and Their Supporting Pre - Driver Series: BLQG50T65 / BLQ40T120, Pre - drivers SAQ3101, HSA6881

Product Features: The IGBT uses advanced trench field - stop (T - FS) technology, which features low VCE(sat), optimized switching performance, and low gate charge Qg.

Applications: Automotive air - conditioning electronic compressors, PTC heating modules, OBC.

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4. Automotive - Grade Ultra - High - Voltage MOSFETs Series Products: BLQ4N80 / BLQ3N100E / BLQ3N120

Product Features: Silicon - based N - channel enhancement - mode MOSFETs with withstand voltages of up to 800V/1000V/1200V respectively. They use advanced MOSFET technology to reduce on - state loss, improve switching performance, and enhance avalanche energy.

Applications: BMS, on - board auxiliary power supplies, main - drive electronic discharge switches, etc.

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5. EEPROM Memory Series Products: BL24C02 / 04 / 08 / 16 / 32 / 64 / 128 / 256 / 512

Product Features: Support 1 million write - erase cycles, 100 - year data retention time, and an I2C interface rate of up to 1Mbps. They feature high reliability, long lifespan, and high speed. In addition, the storage capacity ranges from 2kb to 512kb in a series, and support various packaging forms such as SOP8, TSSOP8, UDFN, SOT23 - 5, facilitating users' free selection.

Applications: On - board cameras, air conditioners, headlights, intelligent cockpits, automotive dashboards, BMS, etc.

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6. Automotive - Grade IGBT Wafer Series Products and Their Supporting FRD Wafers: BLQG275T75F / BLQG200T120, FRD wafers BLQF275N75 / BLK105N120

Product Features: The IGBT wafer uses advanced trench field - stop (T - FS) technology, featuring low VCE(sat) and optimized switching performance. It supports multi - chip modular packaging, allowing users to configure flexibly.

Applications: New - energy vehicle motor power drivers, etc. 

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